Standard Inter-IC Sound and Time Division Multiplexing interfaces for legacy routing or connecting secondary audio peripherals.
: Apply professional-grade BGA flux around the chip. Heat the area to approximately 350°C to 380°C using a hot air station, then lift the IC with tweezers. wcd9341 datasheet
It is important to understand that the full, unabridged WCD9341 datasheet is on Qualcomm’s website. It is distributed only under a Non-Disclosure Agreement (NDA) with Qualcomm Technologies, Inc. To obtain it: wcd9341 datasheet
Robust against interference with high-speed signal processing. Practical Applications and Repair wcd9341 datasheet
From datasheet’s electrical characteristics (VDD = 1.8 V, TA = 25°C):
8.5/10 – excellent for its era, but showing its age in power efficiency and register complexity.