Traditional tin-lead (SnPb) solder alloys possessed high compliance and a lower Young's Modulus (~31.5 GPa). Modern lead-free alloys, such as SAC305 (SnAgCu), exhibit a significantly higher stiffness (~52 GPa). This increased rigidity makes lead-free solder joints far more brittle and susceptible to instantaneous fracture under lower deflection levels. Using IPC/JEDEC-9704 & 9702 Standards for Strain Gauge
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It is important to note that IPC standards are copyrighted documents. While you may find "free" versions online, they are often outdated or unauthorized scans. To ensure you have the most accurate, up-to-date, and legally compliant information, it is highly recommended that you purchase the official PDF directly from the website.
One of the key areas covered in this standard is technology (also known as Intrusive Reflow). This technique allows through-hole components to be soldered during the reflow process, eliminating the need for wave soldering. The IPC-9704 PDF outlines the design rules, stencil requirements, and process parameters to make PIP successful.
Position the gage as close to the corner of the target BGA as possible.
To minimize costs and ensure consistent results: