Unlike other finishes, ENEPIG is designed to excel in five critical areas simultaneously:
The palladium layer acts as a barrier, preventing the immersion gold displacement reaction from aggressively attacking the nickel layer. ipc-4556 pdf
A minimum of 0.030 μm [1.2 μin]. Modern amendments often cap gold at 0.07 μm [~2.8 μin] to prevent issues with solder joint reliability. Unlike other finishes, ENEPIG is designed to excel