IPC-7527 is a for the solder paste printing process. It was released by IPC (Association Connecting Electronics Industries) in May 2012 and holds special significance as the first IPC standard ever developed outside the United States .
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There it was. Section 5.2.3: Edge clearance for step stencils. IPC-7527 is a for the solder paste printing process
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This is the standard for inspecting the final assembly (the "after" picture).
Use the photographic examples in IPC-7527 to train operators on identifying proper paste height and registration.